8329TCF - Fast Cure Thermal Adhesive, High TC

This product has been discontinued. This product has been replaced with:
8329TFF – Fast Cure Thermal Adhesive
8329TCM – Thermal Adhesive, High TC

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 3 hours.This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

Features & Benefits

Thermal conductivity of 1.0 W/(m·K)
1:1 mix ratio
Working life: 4 minutes
Cure time: 3 hours at room temperature or 15 minutes at 65 °C (149 °F)
Flame retardant—meets UL 94V-0 standard
Provides strong electrical insulation
Low CTE prior Tg
High tensile and compressive strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
Shelf life: ≥3 years
RoHS 3 compliant