TIA225GF - Silicone Thermal Gap Filler

TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.

This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads.

If higher thermal conductivity is desired, use SilCool TIA241GF.

Features & Benefits

  • Thermal conductivity of 2.5 W/m•K
  • Quick low-temperature cure
  • 1:1 mix ratio
  • Flame retardant—meets UL 94V-0
  • Reworkable
Catalog NumberNet WeightFormat
TIA225GFA50 kg (110 lbs)Pail

Technical Documents