SilCool TIA241GF – Liquid Silicone Thermal Pad

TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.

This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads.

If lower viscosity is required, use TIA225GF

Features & Benefits

  • Thermal conductivity of 4.1 W/m•K
  • Quick low-temperature cure
  • 1:1 mix ratio
  • Flame retardant—meets UL 94V-0
  • Reworkable
Catalog NumberNet WeightFormat
SilCool TIA241GF50 kg (110 lbs)Pail
SilCool TIA241GF3.63 kg (7.93 lbs)Dual cartridge

Technical Documents