Epoxy Potting Compounds
Conductive Pens
Epoxy Potting Compounds
Conductive Pens
At MG Chemicals, we’re committed to driving innovation and empowering the next generation of scientific pioneers. Our University Project Sponsorship opportunities are tailored to fuel creativity, collaboration, and groundbreaking discoveries within the academic sphere. If you’re a university educator, researcher, or student looking to transcend the boundaries of chemistry and technology, we invite you to explore the endless possibilities with MG Chemicals.
Learn MoreTIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads.
If lower viscosity is required, use TIA225GF
Catalog Number | Net Weight | Format |
---|---|---|
SilCool TIA241GF | 50 kg (110 lbs) | Pail |
SilCool TIA241GF | 3.63 kg (7.93 lbs) | Dual cartridge |