4860-4867 - Sn63/Pb37 No Clean Solder Wire

The 4860–4867 Sn63/Pb37 No Clean Solder Wires are electronic grade solder wires. These no clean solder wires use the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. They meet J-STD-004B, ASTM B 32, and exceed J-STD-006C specifications. The 63 37 solder wire is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

For Sn63/Pb37 RA solder wires visit 4880-4888. We also offer Sn60/Pb40 no clean solder wires and Sn60/Pb40 RA Solder wires.

For lead free solder wires visit 4900-4917, 4901, and 49500WS.

Features & Benefits

  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Non-conductive residue
  • Halide free
Catalog NumberSizeDiameterGaugeDescription
4860-18G18 g (0.6 oz)0.81 mm (0.032 in)21Pocket pack
4865-227G227 g (0.5 lb)0.81 mm (0.032 in)21Spool
4865-454G454 g (1.0 lb)0.81 mm (0.032 in)21Spool

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