4860-4867 - Sn63/Pb37 No Clean Solder Wire
The 4860–4867 Sn63/Pb37 No Clean Solder Wires are electronic grade solder wires. These no clean solder wires use the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. They meet J-STD-004B, ASTM B 32, and exceed J-STD-006C specifications. The 63 37 solder wire is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
Features & Benefits
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Spreads like rosin-activated flux
- Virtually non-splattering
- Non-corrosive residue
- Non-conductive residue
- Halide free
|4860-18G||18 g (0.6 oz)||0.81 mm (0.032 in)||21||Pocket pack|
|4865-227G||227 g (0.5 lb)||0.81 mm (0.032 in)||21||Spool|
|4865-454G||454 g (1.0 lb)||0.81 mm (0.032 in)||21||Spool|