Epoxy Potting Compounds
Liquid Thermal Gels
Epoxy Potting Compounds
Liquid Thermal Gels
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The 4933–4935 Sn100e No Clean Solder Wire is an electronic grade solder wire. It uses a high-purity, eutectic tin/copper/cobalt alloy that is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The 4933–4935 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
This solder is a great lead-free alternative to leaded solders. It generally provides better wetting, contact angle, flow, and visual appearance than typical Sn63/Pb37 no clean solders, while still delivering excellent performance characteristics. It offers superior solder penetration into plated through holes and surface mount interconnects. Further, it is a suitable replacement for SAC305 solder since the 493x forms brighter, shinier, and less grainy joints. Furthermore, it is less expensive than SAC305.
The 4933–4935 solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
Catalog Number | Sizes Available | Diameter | Gauge | Description |
---|---|---|---|---|
4933-112G | 112 g (0.25 lb) | 0.51 mm (0.020″) | 25 | Spool |
4933-454G | 454 g (1.0 lb) | 0.51 mm (0.020″) | 25 | Spool |
4935-112G | 112 g (0.25 lb) | 0.81 mm (0.032″) | 21 | Spool |
4935-454G | 454 g (1.0 lb) | 0.81 mm (0.032″) | 21 | Spool |