4860P - Sn63/Pb37 Solder Paste - No Clean

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

We also offer a no clean lead free solder paste and a no clean low temperature solder paste.

Features & Benefits

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Non-corrosive
  • Non-conductive residue
  • Halide free
  • Good wettability
  • Type 3 (45-25 µm)
Catalog NumberSizeFormat
4860P-35G35 g (1.23 oz)Syringe

Safety Data Sheet