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The 4860–4867 Sn63Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.


  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Non-conductive residue
  • Halide free
Catalog Number Size Diameter Gauge Description
4860-18G 18 g (0.6 oz) 0.81 mm (0.032 in) 21 Pocket pack
4865-227G 227 g (0.5 lb) 0.81 mm (0.032 in) 21 Spool
4865-454G 454 g (1.0 lb) 0.81 mm (0.032 in) 21 Spool
4866-227G 227 g (0.5 lb) 1.01 mm (0.040 in) 19 Spool
Safety Data Sheet
Technical Data Sheet
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