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The 4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder blended with a no clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. No clean means that residues are not harmful to assemblies.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.

 

Features
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Non-corrosive
  • Non-conductive residue
  • Halide free
  • Good wettability
  • Type 3 (45-25 µm)
  • Dobb Frank (DRC conflict free)
  • REACH (compliant)
  • RoHS (non-compliant)
Catalog Number Size Format
4860P-35G 35 g (1.23 oz) Syringe
4860P-250G 250 g (8.81 oz) Jar
4860P-500G 500 g (1.1 lb) Jar

Safety Data Sheet
Technical Data Sheet