Lead-Free Solder Paste

MG Chemicals Lead-Free Solder Paste provides high fluxing activity levels, promote thermal stability and prevent thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, our lead-free solder pastes provide excellent cost savings. They exhibit superior joint strength, excellent wettability, and extraordinary print definition and tack life. Our Lead-Free Solder Paste is offered in 25g syringes and 250g jars.

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux.

The 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3 is made for low temperature applications.