860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

Features and Benefits
  • High thermal conductivity
  • High dielectric strength
  • Broad service temperature of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding
  • Non-electrically conductive
  • Long service life



Catalog Number Sizes Available Packaging
860-4G 1.7 mL (0.06 fl oz) Pouch a)
860-60G 25 mL (0.84 fl oz) Jar
860-150G 62.5 mL (2.11 fl oz) Tube
860-1P 470 mL (15.9 fl oz) Jar

a) Case pack of 100 pouches 


Safety Data Sheet
Technical Data Sheet