860 - Silicone Heat Transfer Compound

860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

Features and Benefits

  • High thermal conductivity
  • High dielectric strength
  • Broad service temperature of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding
  • Non-electrically conductive
  • Long service life
Catalog NumberSizes AvailablePackaging
860-4G1.7 mL [0.06 fl oz]Pouch
860-60G25 mL [0.84 fl oz]Jar
860-150G62.5 mL [2.11 fl oz]Tube
860-1P470 mL [15.9 fl oz]Jar
860-3.78L3.78 L [1.00 gal]Pail
Safety Data Sheet
Technical Data Sheet