860 - Silicone Heat Transfer Compound
860 is a cpu thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for cpu applications.
This silicone-based pc thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
For a silicone-free thermal paste, try 8616.
Features & Benefits
- Thermal conductivity of 0.7 W/m.K
- High dielectric strength
- Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
- Excellent corrosion resistance
- Non-bleeding heat transfer paste
- Non-electrically conductive
- Long service life
|Catalog Number||Sizes Available||Packaging|
|860-4G||1.7 mL [0.06 fl oz]||Pouch|
|860-60G||25 mL [0.84 fl oz]||Jar|
|860-150G||62.5 mL [2.11 fl oz]||Tube|
|860-1P||470 mL [15.9 fl oz]||Jar|
|860-3.78L||3.78 L [1.00 gal]||Pail|