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This is a two-part, smooth, dark grey paste that cures to form a hard, durable polymer that is extremely thermally conductive, yet electrically insulating. It is it very viscous because it is highly filled with thermally conductive ceramic powders for maximum thermal conductivity. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

It has a convenient 1-to-1 ratio, a 45 minutes working time, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature.

This product comes packaged in separate 3ml syringes that can be accurately dispensed, or in 50ml or 200ml kits packaged in tubs.

Applications & Usages

This product is designed to bond heat sinks, LED’s, and other heat generating components in electronic assemblies. It is suitable for manufacturing, repair, and hobbyist environments. Use it when a thixotropic adhesive paste with maximum thermal conductivity and a moderate working time is required. For automatic dispensing applications, use the 8329TFM, which has a lower viscosity but slightly lower thermal conductivity.

Features
  • Thermal conductivity: 1.36 W/(m·K)
  • 1:1 mix ratio
  • Working time: 45 minutes
  • Cure time: 1 hour @ 65°C, or 24 hours at room temperature
  • Good adhesive strength
  • Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons
  • Room temperature storage
  • Shelf life greater than two years
Catalog Number Form Net Volume Net Weight Shipping Weight
8329TCM-6ML Syringe 6 mL (0.2 fl oz 14 g (0.52 oz) 40 g (1.4 oz)
8329TCM-50ML Jar 50 mL (1.6 fl oz) 123 g (4.35 oz) 200 g (0.44 lb)
8329TCM-200ML Can 200 mL (6.76 fl oz) 494 g (1.09 lb) 660 g (1.5 lb)

 

Safety Data Sheet
Technical Data Sheet

Product Literature