8329TFF - Fast Cure Thermal Adhesive

This is a two-part, smooth, off white paste that cures to form a hard, durable polymer that is extremely thermally conductive, yet electrically insulating. It is filled with thermally conductive ceramic powders for excellent thermal conductivity. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

It has a convenient 1-to-1 mix ratio, a short 4 minute working life, and a rapid curing rate. For a 1.0 mL sample, the minimal service cure can be achieved in 15 minutes at room temperature, and full cure in 3 hours. It is also flame retardant meeting the UL 94V-0 specification.

This product comes packaged in a 25 mL manual dual syringe or a 50 mL industrial, dual-cartridge for use with a dispensing gun and static mixing tips.

Applications & Usages

The 8329TFF epoxy is used for bonding heat sinks, LED’s, and other heat generating components in electronic assemblies. It is suitable for use in manufacturing operations including automatic dispensing applications. It is also useful in the maintenance, repair, and hobbyist sectors. Use it when a flowable adhesive with excellent thermal conductivity and an extremely fast cure time is required.


Features & Benefits

  • Thermal conductivity of 0.8 W/(m·K)
  • 1:1 mix ratio
  • Working life: 4 minutes
  • Set time: 15 minutes
  • Cure time: 4 hours at room temperature or 15 minutes at 65 °C (149 °F)
  • Flame retardant—meets UL 94V-0 standard
  • Provides strong electrical insulation
  • Low CTE prior Tg
  • High tensile and compressive strength
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
  • Shelf life: ≥3 years
  • RoHS 3 compliant
Catalog NumberSizes AvailableFormat
8329TFF-25ML25 mL (0.84 fl oz)Dual syringe
8329TFF-50ML45 mL (1.52 fl oz)Dual cartridge
Safety Data Sheet
Technical Data Sheet