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General Purpose Adhesives

The 832HD 1:1 Epoxy Potting and Encapsulating Compound is a two-part, economical, flowable, electronic-grade epoxy that provides excellent physical, chemical, and electrical protection.

The 9300 One-Part Epoxy General Purpose Adhesive, Low Tg is a heat cured, electrically and thermally insulating, semi-thixotropic glue for low stress bonding of SMD’s and fiber optic components.

The 8336 Super Contact Cement is a high-strength, solvent-based adhesive that is resistant to heat, water, and oil. Clamping is not required because the adhesive is quick drying and adheres fast upon contact. 

The 9310 One-Part Epoxy General Purpose Adhesive, High Tg is a heat cured, electrically and thermally insulating, thixotropic glue for bonding SMD’s to PCB’s.

Great for repairing foam surrounds, cones and more.