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Thermal Gap Fillers

MG Chemicals thermal gap fillers are silicone materials that work by displacing air between heat-generating components and heat sinks. The gap fillers cure to a soft putty which provide excellent thermal conductivity yet can easily be peeled off allowing for components to be replaced. These materials conform to complex geometries and are excellent alternatives to thermal pads.

Features and Benefits

  • Extremely high thermal conductivities
  • UL94 V-0 approved
  • Reworkable
  • Low temperature curing
  • Convenient 1:1 mix ratio


  • Replaces thermal pads
  • Improved thermal performance over pastes
  • Alternative to adhesives if rework is needed

8327GF25 – Thermal conductivity of 2.5 W/m.K

8327GF41 – Thermal conductivity of 4.1 W/m.K