Epoxy Potting Compounds
Electrically Conductive Adhesives
9410 – 1 Part Epoxy, Electrically Conductive Adhesive, High Tg
Epoxy Potting Compounds
Electrically Conductive Adhesives
9410 – 1 Part Epoxy, Electrically Conductive Adhesive, High Tg
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Home > Products > Thermal Interface Materials > Thermal Gap Fillers
MG Chemicals is the authorized master distributor for Momentive Performance Materials silicone thermal gap fillers. These thermal gap fillers are efficient in maximizing heat dissipation by displacing air between heat-generating components and heat sinks.
They cure to a soft putty which provide excellent thermal conductivity yet can easily be peeled off allowing for components to be replaced. These materials conform to complex geometries and are excellent alternatives to thermal pads.
TIA225GF – Thermal conductivity of 2.5 W/m.K
SilCool TIA241GF – Thermal conductivity of 4.1 W/m.K