Solder Paste

MG Chemicals solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our pastes contain a non-conductive flux making cleaning afterwards unnecessary. Pastes are available in both leaded and non-leaded chemistries with syringe or jar packaging options.

Features and Benefits

• Leaded and non-leaded options
• Alloy exceeds J-STD-006C, meets ASTM B32 purity requirements
• No-clean residues
• Flux meets J-STD-004B
• RoHS compliant

Applications

• Repairs and rework
• Through hole and surface mount
• Solder touch ups
• Component bonding