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Solder Paste
MG Chemicals solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our pastes contain a non-conductive flux making cleaning afterwards unnecessary. Pastes are available in both leaded and non-leaded chemistries with syringe or jar packaging options.
Features and Benefits
- Leaded and non-leaded options
- Alloy exceeds J-STD-006C, meets ASTM B32 purity requirements
- No-clean residues
- Flux meets J-STD-004B
- RoHS compliant
Applications
- Repairs and rework
- Through hole and surface mount
- Solder touch ups
- Component bonding