MG Chemicals’ solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our solder pastes contain a non-conductive flux, making cleaning afterwards unnecessary, plus solder powder with a particle size distribution that complies with the J-STD-005 Type 3 (80% min. between 25-45 µm).
Pastes are available in both leaded and non-leaded chemistries, with syringe or jar packaging options. They can be easily applied using solder paste spatula, solder paste dispensers, or solder paste stencil.
Features and Benefits
- Leaded and non-leaded options available
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- No-clean residues, residues are not harmful to assemblies
- Flux meets J-STD-004B
- Repairs and rework
- Through-hole and surface mount
- Solder touch-ups
- Component bonding