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Solder Paste

MG Chemicals solder pastes ensure strong adhesion when connecting PCB components to copper pads during board fabrication. Our pastes contain a non-conductive flux making cleaning afterwards unnecessary. Pastes are available in both leaded and non-leaded chemistries with syringe or jar packaging options.

Features and Benefits

  • Leaded and non-leaded options
  • Alloy exceeds J-STD-006C, meets ASTM B32 purity requirements
  • No-clean residues
  • Flux meets J-STD-004B
  • RoHS compliant

Applications

  • Repairs and rework
  • Through hole and surface mount
  • Solder touch ups
  • Component bonding

4860P Sn63/Pb37 No clean solder paste

4900PSAC305 No clean solder paste

4902PSn42/Bi57/Ag1 No clean low temperature solder paste

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