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Epoxy Potting Compounds

MG Chemicals offers a wide range of epoxy potting compounds for protecting printed circuit boards and electronic devices. Our electronic epoxy encapsulant potting compounds provide superior protection against water damage and chemical, mechanical, thermal or electrical shock. These epoxy resin formulations offer many special functions, including flame retardancy, thermal conductivity, optical clarity, and dimensional stability.

Features & Benefits

  • Convenient mix ratios
  • UL94 V-0 and UL 746A grades available
  • Thermally conductive options available
  • Low exotherm
  • Excellent dielectric properties
  • Wide service temperature range
  • Primeless adhesion to most substrates
  • Superior physical and mechanical properties
  • RoHS compliant

 Applications

  • PCBs protection in commercial transportation
  • Circuit protection for oil and gas sensors
  • Encapsulation of transmitter components in deep sea telecom cables
  • Ruggedization for LED drivers
  • IP protection

One-Part

9510 – Black, rigid, low viscosity, unlimited working time. Heat cure only. Does not require frozen storage and reduces manufacturing cost by eliminating mixing process of epoxy resin and hardener. Provides extreme chemical resistance.

Two-Part

832B – Black, rigid, 2:1 mix ratio, low viscosity, 1 hour working time. Cures at room temperature or higher.

832HD – Black, rigid,1:1 mix ratio, low viscosity, 45 min working time. Cures at room temperature or higher.

832C – Translucent, rigid, 2:1 mix ratio, low viscosity, 1 hour working time. Cures at room temperature or higher. Ideal for applications requiring visual inspection.

832WC – Optically clear, rigid, 2:1 mix ratio, low viscosity, 1 hour working time. Cures at room temperature or higher. Ideal for potting lighting fixtures and casting applications

832FX – Black, flexible, 1:1 mix ratio, very low viscosity, 2.5 hours working time. Cures at room temperature or higher. Ideal choice when minimizing stress on components is critical.

832HT – Black, rigid, 1.7:1 mix ratio, 1 hour working time. Extreme chemical resistance. Cures at room temperature or higher. Ideal for high temperature applications.

832TC – Black, thermally conductive (TC of 0.68 W/m.K), 1:1 mix ratio, low exotherm, 2 hour working time. Cures at room temperature or higher.

Two-part – Flame Retardant

834B – Meets UL 94V-0 standard, thermally conductive (TC of 0.8 W/m.K), 2:1 mix ratio, rigid, black, low exotherm, 1 hour working time. Cures at room temperature or higher.

834HTC – UL 746A certified, thermally conductive (TC of 0.94 W/m.K), 5:1 mix ratio, rigid, black, low exotherm, low CTE, 1.5 hour working time. Cures at room temperature or higher.

834FX – Meets UL 94V-0 standard, thermally conductive (TC of 0.6 W/m.K), 1:1 mix ratio, flexible, black, low exotherm, 2.5 hour working time. Cures at room temperature or higher.

Category Data Sheets


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