Thermal Paste
MG Chemicals offers a full line of thermal pastes used to improve the efficiency of heat transfer between heat sinks and electronics components. When placed between heat-generating components and heat sinks, these greases displace air pockets, which ensures full contact between the two surfaces, and prevents overheating.
Features and Benefits
- High thermal conductivity
- Non-electrically conductive
- Excellent corrosion resistance
- Thixotropic, non-sagging
- Odorless
Applications
- Thermal management for computers and game system consoles
- Heat-dissipation for motors and LEDs
860 – Silicone heat transfer compound. Operating temperature range -40 to 200°C. Thermal conductivity 0.7 W/m.K
8616 – Non-silicone heat transfer compound. Operating temperature range -68 to 165°C. Thermal conductivity 1.8 W/m.K
8617 – Non-silicone heat transfer compound. Zinc oxide free. Operating temperature range -68 to 165°C. Thermal conductivity 1 W/m.K