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Thermal Paste

MG Chemicals offers a full line of thermal pastes used to improve the efficiency of heat transfer between heat sinks and electronics components. When placed between heat-generating components and heat sinks, these greases displace air pockets, which ensures full contact between the two surfaces, and prevents overheating.

Features and Benefits

  • High thermal conductivity
  • Non-electrically conductive
  • Excellent corrosion resistance
  • Thixotropic, non-sagging
  • Odorless

Applications

  • Thermal management for computers and game system consoles
  • Heat-dissipation for motors and LEDs

860Silicone heat transfer compound. Operating temperature range -40 to 200°C. Thermal conductivity 0.7 W/m.K

8616Non-silicone heat transfer compound. Operating temperature range -68 to 165°C. Thermal conductivity 1.8 W/m.K

8617Non-silicone heat transfer compound. Zinc oxide free. Operating temperature range -68 to 165°C. Thermal conductivity 1 W/m.K

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