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Electroless Plating

MG Chemicals offers a liquid tin product that lets you quickly and easily deposit a thick layer of tin over copper traces or solder deposits. The tin overcoat acts as a barrier against harmful corrosion of exposed copper, and can ensure good solderability for solder deposits by cleaning them and activating their surfaces.

Features and Benefits

  • Ready-to-use; requires no dilution
  • Works quickly, in 30-60 seconds
  • Stable solution
  • Good adhesion

Applications

  • Proof-of-concept prototyping and small production runs
  • Hobbyist circuit design or school tutorials
  • 421A – Easy-to-use tin solution that requires no preparation or dilution