Electroless Plating

MG Chemicals offers a liquid tin product that lets you quickly and easily deposit a thick layer of tin over copper traces or solder deposits. The tin overcoat acts as a barrier against harmful corrosion of exposed copper, and can ensure good solderability for solder deposits by cleaning them and activating their surfaces.

Features and Benefits

• Ready-to-use; requires no dilution
• Works quickly, in 30-60 seconds
• Stable solution
• Good adhesion

Applications

• Proof-of-concept prototyping and small production runs
• Hobbyist circuit design or school tutorials