Electroless Plating
MG Chemicals offers a liquid tin product that lets you quickly and easily deposit a thick layer of tin over copper traces or solder deposits. The tin overcoat acts as a barrier against harmful corrosion of exposed copper, and can ensure good solderability for solder deposits by cleaning them and activating their surfaces.
Features and Benefits
- Ready-to-use; requires no dilution
- Works quickly, in 30-60 seconds
- Stable solution
- Good adhesion
Applications
- Proof-of-concept prototyping and small production runs
- Hobbyist circuit design or school tutorials
- 421A – Easy-to-use tin solution that requires no preparation or dilution