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Thermally Conductive Adhesives

MG Chemicals offers thermally conductive epoxy adhesives for bonding heat sinks, LEDs, and other heat generating electronic components. They feature strong adhesion to metal, good adhesion to plastics, and excellent physical strength.

Our 1-part epoxies offer unlimited working time, do not require mixing, and can be stored at room temperature. 2-part epoxies are 1:1 mix ratio and are available in a variety of working times (w.t.).

Features & Benefits

  • Creates strong permanent thermal bonds
  • Eliminates need for mechanical fasteners
  • Excellent thermal conductivity (TC)
  • Provides strong electrical insulation
  • Room temperature storage
  • Maintains bonds in severe environments
  • Excellent chemical resistance
  • Excellent mechanical stability
  • A wide variety of working times (w.t.)

Applications

  • Bonding heat sinks
  • Power semiconductor devices
  • Flip chip BGA heat spreaders
  • Battery modules and battery packs
  • LED lighting
  • Power Supplies
  • Automotive lighting
  • Appliances

One-part

9460TC – Thermal conductivity of 0.8 W/(m.K), unlimited working time. It does not require frozen storage and reduces manufacturing cost by eliminating mixing process of epoxy resin and hardener. Heat cure only.

Two-part

8329TFF – Thermal conductivity of 0.8 W/(m.K), UL 94V-0 rated (Flame retardant), 5 minute working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Can be cured at room temperature or higher.

8329TCF – Thermal conductivity of 1.0 W/(m.K), 5 minute working time. Non-sagging paste. Can be cured at room temperature or higher.

8349TFM – Thermal conductivity of 1.1 W/(m.K), meets UL 94V-0 (Flame retardant), 20 minute working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Can be cured at room temperature or higher.

8329TFM – Thermal conductivity of 1.1 W/(m.K), 45 minute working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Can be cured at room temperature or higher.

8329TCM – Thermal conductivity of 1.4 W/(m.K), 45 minute working time. Non-sagging paste. Can be cured at room temperature or higher.

8329TFS – Thermal conductivity of 0.8 W/(m.K), 4 hours working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Heat cure only.

8329TCS – Thermal conductivity of 1.4 W/(m.K), 4 hours working time. Non-sagging paste. Heat cure only.

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