Epoxy Potting Compounds
Soldering Flux
Epoxy Potting Compounds
Soldering Flux
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MG Chemicals offers thermally conductive epoxy adhesives for bonding heat sinks, LEDs, and other heat generating electronic components. They feature strong adhesion to metal, good adhesion to plastics, and excellent physical strength.
Our 1-part epoxies offer unlimited working time, do not require mixing, and can be stored at room temperature. 2-part epoxies are 1:1 mix ratio and are available in a variety of working times (w.t.).
9460TC – Thermal conductivity of 0.8 W/(m·K), unlimited working time. It does not require frozen storage and reduces manufacturing cost by eliminating mixing process of epoxy resin and hardener. Heat cure only.
8329TFF – Thermal conductivity of 0.8 W/(m·K), UL 94V-0 rated (Flame retardant), 5 minute working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Can be cured at room temperature or higher.
8349TFM – Thermal conductivity of 0.9 W/(m·K), meets UL 94V-0 (Flame retardant), 20 minute working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Can be cured at room temperature or higher.
8329TCM – Thermal conductivity of 1.4 W/(m·K), 45 minute working time. Non-sagging paste. Can be cured at room temperature or higher.
8329TFS – Thermal conductivity of 1.2 W/(m·K), 4 hours working time. Viscous, yet flowable enough to be dispensed from a syringe or a mixing tip. Heat cure only.
8329TCS – Thermal conductivity of 1.4 W/(m·K), 4 hours working time. Non-sagging paste, NASA low outgassing approved, Heat cure only.
8329HTC – Thermal conductivity of 0.9 W/(m·K), 80 minute working time. Thixotropic paste with minimal flow, allowing localized application into tight spaces.Can be cured at room temperature or higher.