
63% tin, 37% lead
M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator. Our No Clean formula wets and spreads like normal RA type flux and does not splatter.Features / Benefits
| Catalog Number | Size | Diameter | Gauge | Description |
|---|---|---|---|---|
| 4860-18G | 18 g (0.6 oz) | 0.032" | 22 | Pocket pack (box of 25) |
| 4865-227G | 1/2 lb (227 g) | 0.032" | 22 | Spool |
| 4865-454G | 1 lb (454 g) | 0.032" | 22 | Spool |
| 4866-227G | 1/2 lb (227 g) | 0.04" | 20 | Spool (No Clean) |
| 4867-227G | 1/2 lb (227 g) | 0.05" | 18 | Spool (No Clean) |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |