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Sn63 / Pb37 No Clean Leaded Solder New Item

 
4860
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  • Description
  • Technical Data
  • MSDS

63% tin, 37% lead

M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator.  Our No Clean formula wets and spreads like normal RA type flux and does not splatter.

Features / Benefits

  • Meets J-STD-004 and QQ-S-571
  • No Clean
  • Standard Flux Core percentage at 2.2%
  • Melting Point: 183°C / 361°F

Available Sizes

Catalog Number Size Diameter Gauge Description
4860-18G 18 g (0.6 oz) 0.032" 22 Pocket pack (box of 25)
4865-227G 1/2 lb (227 g) 0.032" 22 Spool
4865-454G 1 lb (454 g) 0.032" 22 Spool
4866-227G 1/2 lb (227 g) 0.04" 20 Spool (No Clean)
4867-227G 1/2 lb (227 g) 0.05" 18 Spool (No Clean)
Technical Data
Lead free/leaded solder comparison Lead Free Solder (Sn/Cu) Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit Do not to exceed 350 ºC (tip temperature) Do not to exceed 260 ºC (tip temperature)
MSDS
Available MSDS: