Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
|Catalog Number||Sizes Available||Description|
|860-4G||4g x 100||Pail of 100 singles|
|860-60G||60g (2 oz)||Jar|
|860-150G||150g (5 oz)||Tube|
|860-1P||1 pint (2.5 lbs)||Tub|
View an animated demonstration of how to apply Silicone Heat Transfer Compound