Thermally Conductive Adhesives

An electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks. It has a convenient 1-to-1 ratio, a workable 3 to 5 minutes pot life, and a moderate curing rate. For a 1.0 mL sample, the minimal service cure can be achieved in 15 min at room temperature, and full cure in 80 min.

An electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

An electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn’t require temperatures as high as 130 and 170 °C, and it will cure at a more moderate 80 °C in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.