The 8331 Silver Conductive Epoxy Adhesive: Moderate Cure is an economical electronic epoxy with good electrical and thermal conductivities. This adhesive bonds very well to a variety of surfaces. It has a convenient 1-to-1 ratio, a workable ten minutes pot life, and a moderate curing rate. It achieves an operational level in five hours at room temperature. With heat, the 8331 cures in less than 15 minutes and maximizes its conductivity. The cured adhesive bonds very well to most substrates used in electronic assemblies; resists thermal and mechanical shocks; and provides the low resistivity needed for many operating conditions. The 8331 epoxy adhesive is great for forming conductivity seals, bonding, and repairing of electronic devices.
|Catalog Number||Sizes Available||Description|
|8331-14G||14 g, 6 mL||Two 7g syringes, 3mL each|
|8331-50ML||115 g, 50 mL||Paste|
|8331-200ML||460 g, 200 mL||Paste|
The 8331 epoxy has many uses. It is primarily used as a solder replacement for bonding heat-sensitive electronic components. It allows for quick cold soldering repairs, and is effective at bonding heat sinks to other components and PCBs. It also provides excellent EMI/RFI shielding, and is very effective at filling in seems between metal plates.
Its primary applications are repair and assembly of electronics in microelectronics and optoelectronics. It is used in the automobile, aerospace, marine communication, instrumentation, and industrial control equipment industries.
Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity.
CAUTION! Do not cross contaminate. To avoid premature curing, use different stirring tools for parts A & B.
To prepare 1:1 (A:B) epoxy mixture:
1. Remove syringe cap or jar cover.
2. or jars, stir each part individually to re-incorporate material that may have settled during storage.
3. Measure one part by volume of A.
4. Measure one part by volume of B.
5. Thoroughly mix the parts together with a stir stick until homogeneous.
6. Apply to with an appropriate sized stick for the application area.
NOTE: Remember to recap the syringe or container promptly after use.
TIP: Due to the high viscosity and abrasiveness of the silver filler, you may preheat part A and part B to increase the flow and improve air release, but doing so will also reduce the working time by about half for each 10 °C increments.
To heat cure the 8331 epoxy:
Put in oven at 65 °C [149 °F] for 15 minute.
TIP: Hair dryers are normally rated not to exceed 60 °C, so they can generally be used to accelerate the cure.
You can cure the epoxy faster by using higher temperatures of up to 150 °C [302 °F].
ATTENTION: Keep the curing temperature well below temperature limit of heat sensitive components that may be present. As a guideline, remember that commercial grade devices normally can be safely operated up to 70 °C, industrial grade up to 85 °C, and military grade up to 175 °C.
ATTENTION: Heat guns can easily exceed the temperature limits for your assembly: they should not be used.
To room temperature cure the 8331 epoxy:
Let stand for 5 to 24 hours.
TIP: While the product can be cured at room temperature, the best conductivity is achieved with the application of some heat.
A slight discoloration of the 8331 epoxy may occur over time. The discoloration does not affect the adhesiveness or conductivity.
This product cannot be soldered through cleanly and safely for the printed circuit assembly components.
Q. Can I solder to Silver Conductive Epoxy?
A. No, Silver Conductive Epoxy has the temperature contraints of an epoxy and cannot be soldered to. Soldering to this product will cause it to melt.
Q. My 8331 product has a small discoloration. Is this a problem?
A. The discoloration is not a problem and will not affect the adhesive nor the conductive properties.