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This is a two-part, smooth, silver paste that cures to form a hard, durable polymer that is highly conductive, electrically and thermally. It adheres strongly to metals, glass, and well to most plastics used in electronic assemblies.

It has a convenient 1-to-1 ratio, and a 10 minute working time. It achieves an operational cure in five hours at room temperature and full cure in a day. At 65°C, it cures in only 15 minutes.

 

Applications and uses:

The 8331 can be used as a solder replacement for bonding heat-sensitive electronic components and for making conductive bonds where solder is not an option, such as when bonding to glass, plastics or soft metals. It allows for quick cold soldering repairs of electronic devices, makes excellent thermal connections, provides excellent EMI/RFI shielding, and is very effective at filling in seams between metal plates. It is especially useful in repairing rear window defrosters on automobiles.

Its primary applications are in the repair and assembly of electronic devices. It is used in the automobile, aerospace, marine, communication, instrumentation, and industrial control equipment industries, and is widely used by hobbyists and makers.

Catalog Number Form Net Volume Net Weight Shipping Weight
8331-14G Paste 6 mL (0.2 fl oz 14 g (0.47 oz) 0.22 kgh a) (0.5 lb) a)
8331-50ML Paste 53 mL (1.8 fl oz) 128 g (4.12 oz) 0.17 kg (0.4 lb)
8331-200ML Paste 200 mL (6.8 fl oz) 482 g (1.06 lb) 0.58 kg (1.3 lb)

a) Pack of 10

 

Features Applications
  • Electrical resistivity: 0.017 Ω·cm
  • Thermal conductivity: 0.90 W/(m·K)
  • 1:1 mix ratio
  • Working time: 10 minutes
  • Cure time: 24 hours at room temperature or 15 minutes at 65°C
  • Good adhesive strength
  • Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons
  • Room temperature storage
  • Shelf life greater than two years
  • Bonding heat sensitive electronics
  • Quick cold soldering repairs
  • Repairing rear window defrosters
  • EMI/RFI shielding

Safety Data Sheet
Technical Data Sheet

Product Literature