Slow Cure Thermal Conductive Adhesive
An electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient
1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn’t require temperatures as high as 130 and 170 °C, and it will cure at a more moderate 80 °C in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.