| Physical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Appearance |
Visual |
Off white / smooth paste |
White paste |
| Consistency |
ASTM D 217 |
310-320 |
|
Specific Gravity
@ 25°C (77°F) |
|
2.5 min |
2.3 min |
Bleed %
24 hours @ 200°C |
FTM-321 |
1.0% max |
2.0% max |
Bleed %
24 hours @ 200°C |
FTM-321 |
1.0% max |
2.0% max |
Evaporation
24 hours @ 200°C |
ASTM D-566 |
> 500°F (260°C) |
|
| Max. operating temp. |
|
200°C |
200°C (consistent)
300°C intermittent |
| Electrical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Thermal Conductivity |
Hot Wire Method Heat Flow #36 °C |
18.48 x 10-4 (K Factor, Cal/Sec cm•K |
0.657 W/m•K |
Dielectric Strength
(0.05l gap) |
ASTM D-149 |
350 V/MIL |
400 V/MIL |
| Dielectric Constant @ 1000 Hz |
ASTM D- 150 |
4.4 |
3.81 |
Dissipation Factor
@ 1000 Hz |
ASTM D 150 |
0.0021 |
0.0032 |
| Resistivity @ 21°C |
ASTM D 150 |
6.38 x 1013 Ohm/cm |
1.5 x 1015 Ohm/cm |