epoxies
  Black Epoxy
  Clear Epoxy
  Epoxy Mold Release
  Fast Set Epoxy
  Flame Retardant Epoxy
  High Temperature Epoxy
  Optically Clear Epoxy
  Silver Conductive Epoxy
  Thermally Conductive Epoxy
MG Chemicals All Products
Jump to Product Number

  3M Engineered Fluids
  3M Electronic Liquids
  Accessories
  Adhesives
  Brushes
  Contact Cleaners
  Desoldering Braid
  Dusters & Circuit Coolers
  Electroless and Electroplating
  Electronic Cleaners
  EMI / RFI Shielding
  Epoxies
  Flux and Flux Remover
  Greases & Lubricants
  Isopropyl Alcohol
  Lead Free Solder
  Leaded Solder
  Pens
  Potting & Encapsulating
  Protective Coatings
  Prototyping Materials
  RTV Silicones
  Screen Cleaners
  Soldering/desoldering
  SpecialtyCleaners
  Specialty Products
  Swabs
  Thermal Management
  Thermally Conductive Adhesives
  Wipes

 

RoHS Compliant Black Epoxy
Encapsulating and Potting Compound
Black832B
Buy this product now


ATTENTION
Mixing ratio for this product is 2 parts A to 1 part of B. Please be advised that there is a misprint on our label for one of the production runs.

Protects sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemicals, and visual inspection.

Features

  • Non-porous, water and chemical resistant
  • Extremely impact resistant (contains a form of nylon)
  • Colored black, to prevent visual inspection
  • Affords high security, once cured, extremely difficult to remove
  • Non-conductive, an electrical insulator
  • Low toxicity
  • Suitable for explosion proof components (spark arresting)
  • Easy and simple to mix
  • Long pot life
  • Can be cured in one hour at 65°C (150°F)
  • This product is RoHS compliant
Specifications

Uncured Properties - Resin [Part A]
Viscosity2,500 cps
Specific Gravity1.1273
ColorBlack
Uncured Properties - Hardener [Part B]
Viscosity11,000 cps
Specific Gravity0.9564
ColorClear, amber tint
Cured Properties - Physical
Mixed Viscosity3,300 cps
Mixed Specific Gravity1.0577
Volume Mix Ratio (resin:hardener)2.0:1
Mass Mix Ratio (resin:hardener)2.3:1
Shore Hardness80 - 82 Shore D
Tensile strength (ASTM D 638)8475 psi
Elongation3.3%
Compression strength (ASTM D 695)14,675 psi
Modulus375,000 psi
Flexural strength (ASTM D 790)16,500 psi
Modulus427,000 psi
Izod impact strength (ASTM D 256)
0.443 ft-lbs / inch notch
0.259" thick
Lap Shear Strength (ASTM D 732)957 psi
Working time (100g)60 min.
Curing Time (100g)  
@ room temp. 24 hours
@ 65°C 60 minutes
@ 80°C 45 minutes
@ 100°C 35 minutes
Cured Properties - Temperature
Coefficient of Thermal Expansion
(ASTM E 831)
104 ppm/°C
Constant Service Temperature

-30 °C (-22 °F) to 140°C (284°F)

Intermediate Service Temperature
145°C (293°F)
Heat Deflection Temp. (264 psi)
(ASTM D 648)
46.638°C (115.95°F)
Cured Properties - Electrical
Surface Resistivity (ASTM D 257)5.3 x 1012 ohm · cm
Corrected Dissipation Factor, D 0.008 @ 1KHz
(ASTM D150-98) 0.013 @ 10KHz
  0.018 @ 100KHz
  0.017 @ 1MKHz
Dielectric Constant (ASTM D150-98) 2.95 @ 1KHz
  2.89 @ 10KHz
  2.83 @ 100KHz
  2.77 @ 1MKHz
Insulative Yes
Conductive No
Breakdown Voltage (ASTM D149-97a) 51.9 kV
Dielectric Strength (ASTM D149-97a) 471 V/mil
Chemical and Solvent Resistance
 Change after
3 days
Change after
45 days
Hydrocloric Acid < 0% < 1 %
Isopropyl Alcohol < 0.3 %< 1 %
Ethyl Lactate < 3 %< 7 %
Acetone< 7% destroyed
Xylene< 2% < 9 %
Iso hexanes < 5 %< 8 %
Mineral spirits < 0.3 %< 0.3 %

832B Peak Exotherm

Sample Size (grams) Peak Exotherm
(Temp. in 0°C)
Time in Minutes
50 44 155
100 63 110
500 110 65


Available Sizes

Catalog NumberSizes AvailableDescription
832B-375ML375ml (12 oz)Liquid
832B-3L3L (0.8 gal)Liquid
832B-12L 12L (3.2 gal) Liquid
832B-60L60L (16 gal)Liquid