| Standards |
| Fungus resistance MIL-V-173C-2 |
|
| Properties |
| Color | Clear |
| Specific
Gravity @ 21°C (70°F),
ASTM D-287 | 0.94 g/ml |
| Viscosity, Dolph Viscosimeter
@ 30°C (86°F) | 44
- 55 sec. |
| Viscosity,
#1 Demmler Cup @ 30°C (86°F) | 40
-50 sec. |
| Build
Up, D.F.T., ASTM D-115 | 2.5
- 3.0 mils |
| Thinner |
M.G
Chemicals Cat No. 435 |
|
Air Drying Time on Strip, ASTM D-115-Set to Touch |
10 min. |
| Federal Specification,
TT-P-1436-Free of After Tack | 1 hour |
| High temperature rating |
150°C |
|
Corrosive Effect on Copper | None |
| VOC Content, ASTM D 6053, lbs/gal
|
4.75 |
| Chemical
Resistance
|
| Water |
Excellent |
|
Acid (10% Sulfuric Acid) |
Excellent |
| Alkali
(1% Sodium Hydroxide) | Excellent |
| Salt Water |
Excellent |
| Oil,
ASTM D-115 | Passed |
| Fungus
Resistance,, MIL-V-173-2 |
|
Aspergillus Niger |
Passed |
|
Aspergillus Flavus |
Passed |
|
Penicillium Funiculosum | Passed |
| Trichoderma
SP | Passed |
|
Electrical Properties |
| Dielectric Strength, Volts/mil (dry) |
1800 |
| Dielectric Strength, Volts/mil (wet) |
1200 |
| Full
cure | 48
hrs. @ 20°C (68°F) 60 min. @ 65°C (149°F) |
Thermal Class (UL-1446) |
| Twisted Pair (Magnet Wire MW28) |
130°C |