Primary Characteristics White Paste Thermally Conductive Excellent adhesion Flame retardant Non-corrosive Neutral cure High strength Fast cure, fast tack-free time No activator required to cure Meets MIL-A-46146 A, corrosion only UL recognized Use for: Bonding heat sinks to: Power transistors, mosfets, processors and PCBs printed circuit boards).

A thixoptropic adhesive that can be used in place of traditional assembly techniques for securing heat sinks. Traditional heat sinks are bolted or mechanically secured in place. The use of this adhesive will increase production throughput due to easy assembly. The 1032 is strong enough to hold a heat sink in place in its uncured state. Adhesion is excellent to a wide variety of substrates.

Specifications

Return to top^