무연납

M.G. Chemicals의 무세척 무연 땜납은 Sn/Ag/Cu(주석/은/동) 합금 재질로 설계된, 표준 주석 및 납 땜납의 무연 대체품입니다. 이 합금은 J-Std-006 및 RoHS의 불순물 요구사항에 준합니다. 모든 일반적인 납땜 작업에 이 땜납을 사용할 수 있습니다. 

M.G. Chemicals의 무연 땜납은 최신 와이어 압출기 및 와이어 인발기를 이용하여 일정한 땜납을 제조합니다. 와이어 압출 프로세스에서 플럭스 코어를 삽입할 때 플럭스 비율을 지속적으로 모니터링하여 플럭스 공극과 불규칙한 와이어를 최소화합니다. 당사의 무연 땜납의 일반적인 플럭스 비율은 2.0-4.0%입니다.

4900–4917 SAC305 무세척 무연 땜납은 Sn/Ag/Cu(주석/은/동) 합금 재질로 설계된, 표준 주석 및 납 땜납의 무연 대체품입니다. 이 합금은 J-Std-006 및 RoHS의 불순물 요구사항에 준합니다.

The 4933–4935 Sn100e Lead Free No Clean Solder is an electronic grade solder wire. It uses a highpurity, eutectic tin/copper/cobalt alloy that is complemented with a no clean, synthetically refined, splatter-proof, resin flux core.

 

The 4901 Sn99 No Clean Solder Wire is an electronic grade solder wire. It uses a high-purity, eutectic Sn99.3/Cu0.7 alloy, which is complemented with a no clean, synthetically refined, splatter-proof resin flux core. The 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.

The 4942–4944 Sn100e RA Solder Wire is an electronic grade solder wire. It uses a high-purity, eutectic tin/copper/cobalt alloy that exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a rosin activated, medium activity flux that is classified as ROM1 according to J-STD-004B.

The 4925–4926 SAC305 RA Solder Wire is an electronic grade, lead-free solder wire. It uses the predominant lead-free alloy composition and exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a rosin activated, medium activity flux that is classified as ROM1 according to J-STD-004B. This solder is a great alternative to leaded solders.

The 49500WS Sn100e Water Soluble Solder Wire is an electronic grade solder wire. It uses a high-purity, eutectic 99.5% tin, 0.5% copper, and cobalt alloy, which is complemented with a water-soluble flux core