솔더 페이스트

MG Chemicals solder pastes are formulated to provide superior connection between surface mount components and the copper traces of a printed circuit board. Our solder pastes are made of powdered virgin non-recycled metals blended with No Clean flux. Offered in Leaded (tin/lead) and Lead-Free tin/silver/copper formulations, they leave non-conductive, non-corrosive and highly insulated post soldering residues. Perfect for printed circuit board assembly and repair our pastes are available in convenient syringes or jars.

The 4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder blended with a no clean flux to form a paste.

The 4902P Sn42Bi57Ag1 Low Temperature Solder Paste T3 is made for low temperature applications.

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux.