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MG Chemicals solder pastes are formulated to provide superior connection between surface mount components and the copper traces of a printed circuit board. Our solder pastes are made of powdered virgin non-recycled metals blended with No Clean flux. Offered in Leaded (tin/lead) and Lead-Free tin/silver/copper formulations, they leave non-conductive, non-corrosive and highly insulated post soldering residues. Perfect for printed circuit board assembly and repair our pastes are available in convenient syringes or jars.

M.G. Chemicals No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin and Lead metal powder blended with a No Clean flux to form a paste.

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux.

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux.